Laser beam lithography
The DWL 66 is a laser lithography system (helium-cadmium laser with wavelength 442 nm), with very high resolution pattern generator (up to 0.5 µm with 2 mm lens), for direct writing of microstructures and low volume mask making. The system includes : three optical lenses, 2 mm, 10 mm and 40 mm; an autofocus air gauge system that allows lithography even on transparent substrates; high resolution interferometer to control the position of the stage with high accuracy during the operation. The DWL 66 is also equipped with two cameras used for metrology and alignment purposes and this enables one to perform overlay exposures with high accuracy. The system allows one to process samples of different size (from small pieces, 10 mm × 10 mm, up to 6 inches wafer) and arbitrary shape.
Staff contact: Salvatore Di Franco
