Micro-nanomachining and Electrochemical lab
The micro-nanomachining lab is equipped with:
- a Chemical wet bench to fabricate high aspect ratio Silicon structures. The system allows the wet etching with alkaline solutions (KOH, TMAH) and the oxide removal processes of samples and wafers of dimensions up to 6 ”
- Two Potentiostat-Galvanostat systems, operating in low (PAR 283 10-2 - 10-12 Amp) and high current (PAR 263A up to 20 Amp) regime, and a Frequency Response Detector for electrochemical processing and Porous Silicon formation
- a Quartz Micro-Balance to appreciate monolayer depositions in solution with static and under flux cells
- a Gold Plating System which allows process of samples and wafers of dimensions up to 6”
- a Dry Film Laminator System RLM 419 with electrically heated lamination roller with uniform temperature distribution for dry films lamination, photo-resist and plastics, on wafers
- a MITUTOYO Measuring Microscope with in situ reflectivity measurements system, Probe-Station for Microfluidic measurements and four electrical probes for resistivity measurements. The stage is also equipped with a PID-controlled heater for in situ annealing of the sample from RT up to 200°C
- a Piezo-Systems suitable for resonance frequency measurements of MEMS and NEMS structures
Staff contact: Giuseppe D'Arrigo
