Sputtering deposition lab
Dc magnetron sputtering system made by Kenotec (today Kenosistec) The high vacuum chamber (10-9 Torr) is equipped with three metallic cathodes for sequential deposition of multilayer structures, and with a station for etching procedures. It is currently used to deposit thin (about 1 nm) and thick (larger than 1 µm) layers of nickel, cobalt, aluminum and titanium for applications in microelectronic devices as MOS-transistors and Schottky diodes. The system is equipped with two additional inlets for oxygen and nitrogen injection into the deposition chamber for reactive deposition of nitride and oxide such as TiN and TiO2 used in microelectronics and photovoltaics architectures. In situ heating during deposition up to 250°C can be also performed by using an integrated heating stage.
Staff contact: Alessandra Alberti
