Measurements, FEM simulation and spice modeling of a Thermal Conductivity Detector

Data di pubblicazione: 10 Mag 2011

ConvegnoFonte dati: ARCHIVIO

In this paper we present a micromachined Thermal Conductivity Detector (TCD), based on the Ultra Low Power (ULP) technology. The device has been electrically characterized with different Helium gas flows, via a microfluidic experimental setup. Extraction of global thermo-electric parameters, exploited for the development of an electro-thermal Spice model, has been performed directly from the experimental measurements and from 3-D electro-thermal FEM simulations of the device. The resulting Spice model agrees very well with the measurements, with a maximum error less than 0.22%.

Editore
IEEE
Fonte
2011 IEEE International Instrumentation and Measurement Technology Conference
ID archivio
df75bb0009424a144ba1db1863b0e182
Riferimenti
Pages: 1-5