Strain Evaluation in SiC MEMS Test Structures

Data di pubblicazione: 25 Set 2009

RivistaFonte dati: OPENALEXTipo OpenAlex: conference-paperOpen Access
Autori: Matteo Bosi, G. Attolini, B.E. Watts, Bernard Enrico Watts, C. Frigeri, Francesca Rossi, Antonella Poggi, Alberto Roncaglia, Fulvio Mancarella, O. Martı́nez, Oscar Martinez, V. Hortelano, Vanesa Hortelano

This work presents the growth of b SiC on silicon by VPE performed in a home built, horizontal, cold wall reactor. Test structures used to assess the stresses in the film were obtained either by an etch through the wafer from the bottom side of the wafer to produce membranes or an attack from the front to reveal cantilevers. Membranes and cantilevers presented both compressive and tensile strain, depending on film thickness. Raman spectroscopy was used to study strain and defects.

Fonte
ECS Transactions
Volume
25
Fascicolo
8
Pagine
1031-1037
Citazioni
0
ID archivio
f6d4a289ff5fc241015dde7c5505c465
Riferimenti
Volume: 25 Issue: 8 Pages: 1031