Enthalpy based modeling of pulsed excimer laser annealing for process simulation

Data di pubblicazione: 1 Feb 2012

RivistaFonte dati: OPENALEXTipo OpenAlex: articleOpen Access
Autori: Matthias G. Hackenberg, P. Pichler, Karim Huet, R. Negru, Julien Venturini, A. Pakfar, C. Tavernier, Antonino La Magna

We present an enthalpy-based model for pulsed excimer laser annealing of crystalline silicon in the melting regime that integrates into the technology computer-aided design (TCAD) suite Sentaurus Process of Synopsys. The currently one-dimensional model includes laser absorption, a transient simulation of the heat flux, melting of the surface layer, and undercooling during recrystallization. To verify the model, its predictions for a laser pulse with a duration of ∼150 ns and a wavelength of 308 nm were compared to those of a phase-field implementation of melting laser annealing by La Magna et al. The two models show a good agreement for the melt depth, melt duration, and melt front dynamics. In a second step, model predictions were compared to melt depths extracted from SIMS measurements of ion implanted and excimer-laser-annealed silicon samples. They were found to agree within the experimental …

Editore
North-Holland
Fonte
Applied surface science
Volume
258
Fascicolo
23
Pagine
9347-9351
Citazioni
13
ID archivio
f42a6d4b6e4a65d960448e1f97c6a03c
Riferimenti
Volume: 258 Issue: 23 Pages: 9347-9351