Resonant Raman microscopy of stress in silicon-based microelectronics

Data di pubblicazione: 1 Gen 2005

LibroFonte dati: ARCHIVIO

The use of Raman microscopy for the characterisation of strain in microelectronics could not follow the unceasing downscaling of devices without the use of resonance techniques. An excitation source matching the silicon direct bandgap dramatically reduces the penetration of light without significant loss of signal-to-noise-ratio. The investigated volume is limited to strained regions only, and the result is a far better sensitivity. We present a study of the enhancements and drawbacks brought by this technique when applied to the characterisation of some processes in microelectronics.

Editore
Springer, Berlin, Heidelberg
Fonte
Microscopy of Semiconducting Materials
ID archivio
8cee7a98b5bd64d2530a659b73fb3c4f
Riferimenti
Pages: 371-374