In this work, the bridge imaging and the reliability of surface-micromachined capacitive RF MEMS switches in III-V technology are presented. A low cost scanning technique allowed us to image the shape of the moveable bridge with a micrometer spatial resolution, thus quantitatively valuating its lowering as a function of the applied voltage. The reliability of the switches was tested under the application of different unipolar and bipolar voltage waveforms, showing that a significant improvement of the switch operation and lifetime can be achieved by applying high frequency bipolar square pulses with suitable durations.
16 Apr 2013
2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)