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MOEMS and Multifunctional Systems

MEMS (Micro-Electro-Mechanical System) and MOEMS (Micro-Opto-Electro-Mechanical System) devices can be designed to be employed in a wide range of applications. They commonly involve micromachining techniques in their fabrication and may operate exploiting mechanical, thermal, electromagnetic and optical principles.

IMM institute possesses an established know-how related to the design, manufacturing and characterization of MEMS and MOEMS devices, including:

  • Fabrication and characterization of MEMS for microwave and millimeter wave communication, such as switches, electromagnetic resonators, micro and nano-antennas on Si, Al2O3, SiC e GaAs substrates.
  • Integration of innovative functional materials for piezoelectric, thermoelectric and chemical transduction produced with advanced synthesis techniques like Atomic Layer Deposition (ALD) and Metal-Organic Chemical Vapour Deposition (MOCVD) in MEMS.
  • SiC MOEMS for pressure sensing within the cylinders of internal combustion engines.
  • Fiber-optic ultrasonic probes manufactured by MOEMS technology for minimally invasive medical diagnostics.
  • MEMS for micro-energy harvesting from heat sources based on semiconductor nanowires manufactured by top-down technology.
  • MEMS physical sensors suited to be used on automated equipments (resonant strain sensors, absolute pressure sensors, inertial and acoustic sensors for vibrations).
  • Innovative MEMS/NEMS (Nano-Electro-Mechanical Systems) based on two-dimensional materials (graphene, MoS2).

Within the MEMS/MOEMS research activities at IMM, high Technology Readiness Level (TRL) prototypes and demonstrators (up to TRL 5) have been produced.


Coordinator: Proietti Emanuela

Integration of nanostructured catalysts in electrochemical systems for green fuels or electricity production

The realization of electrochemical cells for the synthesis of green fuels, such as hydrogen, by water splitting, or ammonia by reaction of nitrogen gas with water or green hydrogen, represents an...

Piezoelectric MEMS

The research aims to the development of MEMS using thin piezoelectric film deposited by sputtering process. In particular, the optimization of the deposition parameters, in order to obtain highly...

Multifunctional IoT-ready systems for healthcare and quality of life

The research activities are addressed to the design and prototyping of:

1. active (Time-of-Flight, Structured Light, RGB-D) and passive (RGB) vision systems for critical event prediction-...

Multifunctional chemical systems for food analysis and biomedical applications (breath analysis & metabolomics)


The development of future multifunctional chemical sensing devices requires multidisciplinary integration of different skills (physics, engineers, biologists, chemists, physicians) and...

New materials and enabling technologies for MEMS, MOEMS and NEMS


Development and study of new materials and technological processes for MEMS using surface or bulk micromachining, looking for full compatibility with...

High Frequency Devices and Sub-Systems for Ground and Space Applications


The development of high frequency components and sub-systems has a driving market determined by many possible utilizations of the microwave and millimeter wave signal processing,...

Atomic layer deposition for MOEMS and MEMS applications

Due to the high conformality, excellent thickness control, availability of dense and pinhole free films of different materials at low deposition temperature and low cost, atomic layer deposition (...

MOMS fiber-optic transducers


Micro-Opto-Mechanical devices for various applications are fabricated by mounting micromachined structures, obtained from bulk silicon wafers by Deep...

MEMS devices for thermoelectric micro-energy harvesting based on top-down semiconductor nanowires


Polycrystalline silicon nanowires fabricated with top-down technology are utilized as thermoelements in MEMS devices used for micro energy conversion or thermoelectric...

MEMS sensors fabricated by micromachining of Silicon-On-Insulator substrates.

Silicon-On-Insulator (SOI) wafers with device layer thickness in the range 2-25 µm are employed for the fabrication of physical sensors for strain, pressure and temperature. The...