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Type: 
Conference
Description: 
Article PreviewArticle PreviewArticle PreviewGallium nitride (GaN) and related alloys (AlxGa1-xN) are promising semiconductors for high-frequency and high-power devices applications. In particular, the growth of AlGaN/GaN heterostructures on SiC substrates, due to the high thermal conductivity of SiC, can lead to significant improvement in the device performances. An important issue in the fabrication of AlGaN/GaN devices is the influence of the required thermal budget (700-900 C) on the properties of Ohmic contacts and device isolation. In this work, the influence of thermal annealing on the fabrication of AlGaN/GaN devices was studied. Ti/Al/Ni/Au multilayers led to an Ohmic behavior with a specific resistance c in the 10-5 cm2 range upon annealing between 750 C and 850 C. The electrical behavior of Ohmic contacts was correlated with the evolution of the formed phases and with the temperature …
Publisher: 
Trans Tech Publications
Publication date: 
1 Jan 2009
Authors: 

Fabrizio Roccaforte, Ferdinando Iucolano, Filippo Giannazzo, Giuseppe Moschetti, Corrado Bongiorno, Salvatore Di Franco, Valeria Puglisi, Giuseppe Abbondanza, Vito Raineri

Biblio References: 
Volume: 615 Pages: 967-970
Origin: 
Materials Science Forum