The mechanism limiting the channel mobility in metal-oxide-semiconductor field-effect transistors (MOSFETs) fabricated in Al-implanted 4H-SiC is discussed comparing different post-implantation annealings. In spite of the improved interfacial morphology in carbon capped samples during annealing, the observed reduction of the mobility (from 40 to 24 cm2 V−1 s−1) suggests that interfacial roughness does not significantly impact the transport in the channel. Furthermore, the temperature dependence of the mobility demonstrates that Coulomb scattering is the main degradation mechanism due to the presence of trapped charges at the SiO2/SiC interface.