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Type: 
Conference
Description: 
This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/με), very high resolution (4 nε), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.
Publisher: 
IEEE
Publication date: 
16 Jun 2013
Authors: 

Luca Belsito, Matteo Ferri, Fulvio Mancarella, Alberto Roncaglia, Jize Yan, A Ashwin Seshia, Kenichi Soga

Biblio References: 
Pages: 992-995
Origin: 
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)