n+/p diodes have been realized by 300 C phosphorus ion implantation and subsequent annealing at 1300 C. An electrical characterization of the devices as well as a study of the defects introduced by the implantation process has been made. IV measurements pointed out that the diodes maintain a good rectifying behavior up to 737K. DLTS analyses detected the presence of three traps, T2, T3 and T4, which are not due to the implantation process, and a high energy trap, T5, that could be related to the surface states at the Ni/SiC interface.