In this communication, the compatibility of porous silicon and anodic bonding (AB) technologies for the realization of sensing micro components in lab-on-chip applications has been demonstrated. The two techniques have been combined for the fabrication of a chemical sensor, in view of its miniaturization and integration with a smart micro-dosage system. For this application a very quick and low temperature AB process is essential in order to prevent pores filling with thermal oxides.
1 Jan 2008
Sensors And Microsystems