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The metallized insulating substrates work as mechanical supports for the circuitry of Power Module Packages. Due to their specific functions, substrates for power electronics are made by different materials. The conductive metal layers can assume different functions: the top metal serves as power circuitry routing while the bottom metal improves the mechanical robustness and thermal efficiency. Ceramic layer provides excellent electrical insulation. These features play an essential role in the operation of power modules, which are often operated at high voltage and high current density. The substrates, composed by materials with different thermal expansion coefficients, are subjected to cyclic stresses due to temperature variations induced by operative working conditions. The substrate layouts typically include differences in shape and/or thickness between the top and the bottom side; this generates asymmetrical …
Publication date: 
5 Aug 2019

Giuseppe Mirone, Alessandro Sitta, Giuseppe D’Arrigo, Michele Calabretta

Biblio References: 
Volume: 19 Issue: 3 Pages: 537-542
IEEE Transactions on Device and Materials Reliability