Wet and dry etching

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INTRODUCTION

This laboratory is dedicated to isotropic and anisotropic etching of thin films a by wet and dry processes. Here are located also the facilities for substrate and photolithographic mask surface cleaning.

Plasma etching and ashing
	Oxford plasma technology reactive ion etch The system is equipped with O₂, CHF₃, CF₄, Ar gases to have resist ashing, silicon and silicon dioxide etching. The pumping system is roots-rotative pumps and the RF generator is up to 350 W.
Substrate cleaning and polishing
	Wet chemical cleaning Piranha RCA1, RCA1 modified and RCA2 Wet stripping and polishing with acetone and isopropanole alchool
KOH etching
	KOH etching Silicon wet etching is done by KOH bath. The system has an heater keeping the temperature costant by a water flow around the bath.
Wet etching bench
	Metal Aluminum and Aluminum alloy Nichel Titanium Gold Chrome Silicon/Polysilicon Silicon Oxide