-A A +A
Type: 
Journal
Description: 
The fabrication of preamorphized p-type ultrashallow junctions in silicon-on-insulator (SOI) has been investigated. Electrical and structural measurements after annealing show that boron deactivation and transient enhanced diffusion are reduced in SOI compared to bulk wafers. The reduction is strongest when the end-of-range defects of the preamorphizing implant are located deep within the silicon overlayer of the SOI silicon substrate. Results reveal a very substantial increase in the dissolution rate of the end-of-range defect band. A key player in this effect is the buried Si∕SiO2 interface, which acts as an efficient sink for interstitials competing with the silicon surface.
Publisher: 
AIP
Publication date: 
24 Jul 2006
Authors: 

JJ Hamilton, NEB Cowern, JA Sharp, KJ Kirkby, EJH Collart, B Colombeau, Massimo Bersani, Damiano Giubertoni, A Parisini

Biblio References: 
Volume: 89 Issue: 4 Pages: 042111
Origin: 
Applied physics letters