The compatibility of porous silicon and anodic bonding technologies for the realization of sensing micro-components in lab-on-chip applications is demonstrated. In particular, we have developed and tested an innovative anodic bonding process: voltage, time and temperature have been properly matched in order not to affect the properties of the transducing material, which can be strongly modified by thermal treatments through oxidation. Two devices for chemical and biological sensing have been designed, fabricated and tested. The results obtained are very promising, especially regarding further integration of porous silicon and glass with optical and microelectromechanical instruments.