Type:
Journal
Description:
The development of post silicon technologies based on organic materials consolidates the possibility to realize new devices and applications with unusual properties: flexibility, lightweight, disposability. Both materials and processes play a fundamental role in this new electronic framework and have been improved continuously in the last decades. In this contribution, a new perspective will be drawn by considering a complete technology platform that lead printed organic electronics technology from the basic device and materials to a manufacturing process flow, design tools and market applications development. The final goal of the proposed approach is the manufacturing of organic circuits with sub-micron feature size at low fabrication costs with high flexibility and application versatility by using additive manufacturing processes. The identification of suitable material features and process steps and the …
Publisher:
IEEE
Publication date:
29 Aug 2008
Biblio References:
Volume: 8 Issue: 3 Pages: 6-18
Origin:
IEEE Circuits and Systems Magazine