While it is known that F modifies dopant diffusion in crystalline Si, the physical mechanisms behind this process are still unclear. In this work we report experimental studies about the F control of the point defect density in preamorphized Si layers. These studies put the basis for the understanding of the F behavior and for the realization of ultra-shallow junctions. We first investigated the F incorporation process during the solid phase epitaxy (SPE) of amorphous Si layers. We elucidated the role of the SPE temperature on the F incorporation and suggested a new route towards a F profile engineering. Moreover, we explained the role of F in modifying the point defect population (self-interstitials, Is, and vacancies, Vs), employing B and Sb spike layers as markers for Is and Vs, respectively. We clearly showed that F decreases the B diffusion while enhances the Sb one, pointing out the capacity to induce an Is …