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In this paper, we present a new design of MEMS condenser microphone using SOI wafer. To improve the performance of the microphone, a perforated diaphragm with C-shape slots has been designed. The aim is to achieve high sensitivity, low voltage and small size microphone with easy and low cost fabrication process. The structure has a diaphragm thickness of 5 µm, a diaphragm size of 0.38 mmý× ý0. 38 mm. The novelty of this microphone relies on perforated diaphragm includes some C-shape slots to reduce the stiffness of diaphragm to decrease the bias voltage and increase the sensitivity. Moreover, the proposed microphone is fabricated on SOI wafer to minimize the number of masks, deposited layers and fabrication process. The new microphone can be fabricated using just one mask to pattern the proposed diaphragm. The deflection of the new diaphragm is increased 19.5 times rather than traditional …
Publication date: 
1 Jul 2018

Bahram Azizollah Ganji, Sedighe Babaei Sedaghat, Alberto Roncaglia, Luca Belsito

Biblio References: 
Volume: 24 Issue: 7 Pages: 3133-3140
Microsystem Technologies