Flavio Giacomozzi, Giancarlo Bartolucci, Giovanni Capoccia, Giovanni Maria Sardi, Jacopo Iannacci, Girolamo Tagliapietra, Benno Margesin, Romolo Marcelli
 
			  
             
			
				Biblio references: Pages: 1-4   
				Origin: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)