Flavio Giacomozzi, Giancarlo Bartolucci, Giovanni Capoccia, Giovanni Maria Sardi, Jacopo Iannacci, Girolamo Tagliapietra, Benno Margesin, Romolo Marcelli
Biblio references: Pages: 1-4
Origin: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)