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This Special Issue is composed by seven papers, selected and expanded from the contributions presented at the 2014 DTIP Symposium on MEMS and MOEMS (Design, Test, Integration & Packaging of MEMS/MOEMS), held in Cannes, Cote d’Azur on 1–4 April 2014. It was a successful experience in the now long history of the DTIP Symposium, chaired by Bernard COURTOIS, CMP, Grenoble, France, with the significant contribution of the Vice General Chair Pascal NOUET, LIRMM, Montpellier, France and the Co-Chair Jean Michel KARAM, MEMSCAP, Bernin, France. This edition of the Symposium ended with the passing of the baton between Bernard Courtois, who diligently and with great efficiency has played the role of organizer of the event since 1999, and Pascal Nouet, which will continue in the role of Chair from 2015 onwards. So far, first of all the Editor conveys special thanks to Bernard for his continuous …
Springer US
Publication date: 
1 Mar 2015

Romolo Marcelli

Biblio References: 
Volume: 82 Pages: 557-558
Analog Integrated Circuits and Signal Processing