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A study of the carbonization process and of a low temperature buffer layer on the Cubic Silicon Carbide (3C-SiC) epitaxial growth has been reported in this work. From this study it has been evidenced the importance of the C/H 2 ratio and of the buffer layer process on the voids formation at the 3C-SiC/Si interface. From our study, the influence of the voids the wafer curvature is highlighted. It has been observed that decreasing the density of these voids, decreases the stress of the 3C-SiC film; consequently, the wafer curvature is reduced.
Trans Tech Publications Ltd
Publication date: 
1 Jan 2016

Ruggero Anzalone, Nicolò Piluso, Riccardo Reitano, Alessandra Alberti, Patrick Fiorenza, Marco Salanitri, Andrea Severino, Simona Lorenti, Giuseppe Arena, Salvo Coffa, Francesco La Via

Biblio References: 
Volume: 858 Pages: 159-162
Materials Science Forum