WAFER BONDING PROCESSES
| PROCESS | SUBSTRATE MATERIAL | SUBSTRATE # | DIMENSION |
| ANODIC | Si, Pirex | 2 - 3 | 4 INCH |
| FUSION | Si | Up to 3 | 4 INCH |
| GLASS FRIT | Si, Pirex, other | 2 | 4 INCH |
| EUTECTIC | Si | 2 | 4 INCH |
| SIO | Si, SiO2 | 2 | 4 INCH |
CONTACT PERSON: FULVIO MANCARELLA
Brochure IMM
